Brazed diamond blades for slicing single-wafer are specialized cutting tools used for precision cutting of silicon wafers in semiconductor manufacturing operations. They consist of a steel body with a layer of diamond abrasive particles brazed or welded onto its surface. The diamond particles on the brazed diamond blades are carefully arranged in specific patterns and sizes to achieve precise cutting, reduce chipping, and minimize material loss around the sliced wafers' edges. The diamond bonding and brazing techniques used in manufacturing the diamond blades ensure excellent adhesion and superior mechanical properties, including toughness, strength, and durability. You are welcomed to come to our factory to buy the latest selling, low price, and high-quality Brazed Diamond for Slicing Single.Xinghua look forward to cooperating with you.
Brazed Diamond for Slicing Single
Brazed diamond blades for slicing single-wafer are specialized cutting tools used for precision cutting of silicon wafers in semiconductor manufacturing operations. They consist of a steel body with a layer of diamond abrasive particles brazed or welded onto its surface.
The diamond particles on the brazed diamond blades are carefully arranged in specific patterns and sizes to achieve precise cutting, reduce chipping, and minimize material loss around the sliced wafers' edges. The diamond bonding and brazing techniques used in manufacturing the diamond blades ensure excellent adhesion and superior mechanical properties, including toughness, strength, and durability.
Overall, brazed diamond blades for slicing single-wafer are essential cutting tools used in the semiconductor industry for precise cutting of silicon wafers. They offer high precision, durability, and long-lasting performance, making them a reliable and cost-effective solution for semiconductor manufacturing operations.
You are welcomed to come to our factory to buy the latest selling, low price, and high-quality Brazed Diamond for Slicing Single. Xinghua look forward to cooperating with you.
Specifications of Brazed Diamond for Slicing Single
| Model | D (mm) | H (mm) | T (mm) |
| vacuum brazed diamond disc |
100 |
16 / 22.3 | 1.5 - 3 |
| 115 | 16 / 22.3 | 1.5 - 3 | |
|
Grain Size: Rough 25/30, 30/35, 35/40, Finish 50/60 Others Size And Grit Can Be Customized According To Customers' Requirement. |
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Advantages of Brazed Diamond for Slicing Single
High precision cutting: They ensure precise and accurate cuts while minimizing wastage, which is critical in semiconductor manufacturing operations.Clean cuts: The diamond blades provide clean cuts with minimal chipping or cracking of the material being cut, ensuring a high-quality finished product.Durable and long-lasting: The diamond abrasive particles are strongly and evenly attached to the steel body of the blade, providing excellent durability and long-lasting performance even in high-intensity cutting operations.Versatility: The brazed diamond blades are versatile and can be used for cutting various materials, including silicon wafers of different sizes and thickness.
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