Chips For Cutting Micro-Crystals, also known as microcrystalline cutting blades, are made by sintering high-quality diamond, bronze binder (or iron-containing nickel-based alloy) and a certain proportion of binder under vacuum pressure. It is characterized by high hardness, good toughness, wear resistance, high bending strength, non-magnetic properties, and good chemical stability.
The diamond metal bond portion of the tool teeth on the sapphire diamond bronze cutting knife only has a few sinks. Slag drainage and rotation speed are both modest when in use. Bar fare requires too much time. A 2 inch Xmm sapphire bar can currently be extracted from a Sapphire Cutting Machine in China in around 1.5 hours. For a 4-inch Xmm bar, Sapphire Cutting Machine needs around 2.5 hours to complete.
Metal bond Diamond Grinding wheel are used for back thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer rough grinding. Welcome to buy diamond wheels in sapphire wafer thinning lapping grinding from us.
Metal bond Diamond Grinding wheel are used for back thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer rough grinding. Welcome to buy diamond lapping polishing grinding wheel from us.
Sintered rotary dresser is suitable for large quantities of high precision machining and suitable for all kinds of high hardness grinding wheel.
CNC track type diamond rotary dresser general must use sintering processing and manufacturing. Because of its bond with tungsten carbide as skeleton material, cobalt metal as bonding materials, so has good abrasion resistance and strength.
sintered rotary diamond dressers is suitable for large quantities of high precision machining and suitable for all kinds of high hardness grinding wheel.
CNC track type diamond rotary dresser general must use sintering processing and manufacturing. Because of its bond with tungsten carbide as skeleton material, cobalt metal as bonding materials, so has good abrasion resistance and strength.
