Metal bond Diamond Grinding wheel are used for back thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer rough grinding. Welcome to buy diamond wheels in sapphire wafer thinning lapping grinding from us.
Latest Selling Diamond wheels in sapphire wafer thinning lapping grinding Made in China
Sapphire wafers are commonly used in optics, semiconductors and electronics, and are favored for their excellent optical properties and high hardness.As a grinding tool, the diamond grinding wheel can effectively cut and grind sapphire, a high-hardness material, due to its extremely high hardness. The diamond particles are arranged in a specific structure on the surface of the grinding wheel, which can efficiently remove material during the thinning process and maintain good machining accuracy.
Diamond wheels in sapphire wafer thinning lapping grinding
Shape: 6A2T
Body: Aluminum
Bond: Metal
Abrasive: Diamond
Usage: For back thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer rough grinding.
The Diamond wheels in sapphire wafer thinning lapping grindingis extremely hard, not only has excellent optical and mechanical performance and good thermal conductivity, but also has good wear resistance and good wind erosion resistance. It is an ideal LED substrate material. Usually, a diamond wheel or ultrafine diamond powder is used for the sapphire substrates processing.
In the process of LED substrate thinning, the metal bond diamond wheel which developed by forturetools are best option to grind this hard material, long service life with better surfacing result. If you have further finishing requirement,it should also choose high-quality resin bond diamond grinding wheels in sapphire wafer thinning to ensure a good finish and low surface damage during the grinding process. It is a good foundation for the sapphire lapping and polishing, which can greatly improve the production efficiency and reduce costs.
