As the professional manufacture, we would like to provide you Diamond wheel for back side grinding of silicon sapphire wafer. And we will offer you the best after-sale service and timely delivery.
Buy Customized Diamond wheel for back side grinding of silicon sapphire wafer In Stock
Application:
Used for back side thinning and front side precision grinding of silicon sapphire wafer.
Features:
1、various directions of producing chemicals or metallurgical products. Provide with high efficiency of grinding and durable lifetime.
2.stably manufacture technics. Provide with fine roughness of wafer surface.
Specification:
Bond: resin, metal,vitrified.
External diameter: Φ 250 Φ 255 Φ 300 Φ 380, etc.
Grit size:180#～400#
Applicable equipment:
Be used on machines manufactured by NTC, SPEEDFAM,GALAXY,etc.
