Diamond wheel for back side grinding of silicon sapphire wafer
  • Diamond wheel for back side grinding of silicon sapphire waferDiamond wheel for back side grinding of silicon sapphire wafer

Diamond wheel for back side grinding of silicon sapphire wafer

As the professional manufacture, we would like to provide you Diamond wheel for back side grinding of silicon sapphire wafer. And we will offer you the best after-sale service and timely delivery.

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Product Description

Buy Customized Diamond wheel for back side grinding of silicon sapphire wafer In Stock

Application:
Used for back side thinning and front side precision grinding of silicon sapphire wafer.

Features:
1、various directions of producing chemicals or metallurgical products. Provide with high efficiency of grinding and durable lifetime.
2.stably manufacture technics.  Provide with fine roughness of wafer surface.

Specification:
Bond: resin, metal,vitrified.
External diameter: Φ 250 Φ 255 Φ 300 Φ 380, etc.
Grit size:180#~400#

Applicable equipment:
Be used on machines manufactured by NTC, SPEEDFAM,GALAXY,etc.

Hot Tags: Diamond wheel for back side grinding of silicon sapphire wafer, China, Manufacturers, Suppliers, Factory, Made in China, Wholesale, Quotation, Discount, Latest Selling
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