As the professional manufacture, we would like to provide you Diamond wheel for back side grinding of silicon sapphire wafer. And we will offer you the best after-sale service and timely delivery.
Buy Customized Diamond wheel for back side grinding of silicon sapphire wafer In Stock
Used for back side thinning and front side precision grinding of silicon sapphire wafer.
1、various directions of producing chemicals or metallurgical products. Provide with high efficiency of grinding and durable lifetime.
2.stably manufacture technics. Provide with fine roughness of wafer surface.
Bond: resin, metal,vitrified.
External diameter: Φ 250 Φ 255 Φ 300 Φ 380, etc.
Be used on machines manufactured by NTC, SPEEDFAM,GALAXY,etc.