This type of resin bond diamond grinding wheel is used for silicon wafer grinding, it also suitable for single crystal silicon, polycrystalline silicon grinding, and bevelling.As the professional manufacture, we would like to provide you resin bond diamond grinding wheel for silicon wafer. And we will offer you the best after-sale service and timely delivery.
Standard size：200*62*80*5*7 and 200*62*80*15*10
Grit：100#—1000#
Following is the specification of this type of resin bond diamond grinding wheel for silicon wafer:
| Silicon wafer grinding wheel size chart | ||||
| Diameter | Thickness | Hole | Rim Width | Rim Thickness |
| 200 | 35 | 76 | 3,5,6,9 | 3~8 |
| 200 | 50 | 80 | 3,5,6,9 | 3~8 |
| 200 | 60 | 80 | 3,5,6,9 | 3~8 |
| 220 | 65 | 180 | 3,5,6,9 | 3~8 |
| 300~350 | 20~40 | 127 | 5,7 | 3~8 |
