Metal - Sintered Diamond Dicing Blade is used for cutting and slotting varieties of hard or fragile materials. Such as silicon slices,glass,ferrite,quartz crystals,piezoelectric ceramics,optical glass, FR4, BGA and QFN packages, BGA, magnetic heads, optical sensors , communication, MEC, QFN, etc
Metal - Sintered Diamond Dicing Blade is sintered from a combination of diamond powders and metal bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance , is used for cutting and slotting of electronic and optical components.
* Ultra-thin and longer life
* Very high rigidity and very low wear rates (Slower wear rate than Resin but faster than Nickel)
* Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)
* Able to control diamond concentration to achieve cutting quality
Metal diamond dicing blade is used for cutting and slotting varieties of hard or fragile materials. Such as silicon slices,glass,ferrite,quartz crystals,piezoelectric ceramics,optical glass, FR4, BGA and QFN packages, BGA, magnetic heads, optical sensors , communication, MEC, etc
